{"product_id":"9781032528403","title":"Direct Copper Interconnection for Advanced Semiconductor Technology","description":"\u003cp\u003eIn the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.\u003c\/p\u003e","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":42497989607499,"sku":"00000_00000_00000_00000","price":4135.43,"currency_code":"THB","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0641\/0023\/7387\/files\/9781032528403-1.jpg?v=1783572019","url":"https:\/\/kinokuniya.co.th\/th\/products\/9781032528403","provider":"Books Kinokuniya Thailand","version":"1.0","type":"link"}